PCB CAPABILITIES

Item	Description		Technical capabilities
1	Materials		FR4, H-TG, Teflon, Rogers, Ceramics, Aluminum, FPC
2	Surface Finished		HAL, ENIG, Imsn OSP, Plating AG, Plating gold
3	Layers		1-32 layers
4	Max. Board size		610 × 2000mm
5	Max. Board Thickness		6mm
6	Min. Board Thickness		2-layers 0.15mm
			4-layers 0.4mm
			6-layers 0.6mm
			8-layers 1.5mm
			10-layers 1.6mm
7	Internal layer designed trace width / space (minimum)	Copper Thickness 1/3 OZ.	3mil (0.0762mm)
		Copper Thickness 1/2 OZ.	4mil (0.100mm)
		Copper Thickness 1 OZ.	5mil (0.127mm)
		Copper Thickness 2 OZ.	7mil (0.178mm)
		Copper Thickness 3 OZ.	8mil (0.203mm)
		Copper Thickness 4 OZ. +	10mil (0.254mm)
8	Copper thickness		1/3 OZ. - 10 OZ.
9	Min. S / M Pitch		0.1mm (4mil)
10	Min. hole size		0.15mm (6mil)
11	Min. blind / buried via		0.2mm (8mil)
12	Hole dia. Tolerance (PTH)		±0.05mm (2mil)
13	Hole dia. Tolerance (NPTH)		±0.05mm (2mil)
14	Hole position deviation		±0.05mm (2mil)
15	Outline tolerance		±0.10mm (4mil)
16	Solder mask Color		Black, Yellow, Blue, Green, Red, White
17	Silkscreen Color		White, Black, Yellow
18	Silkscreen Font Thickness (minimum)		0.15mm (6mil)
19	Twist & Bent		0.75%
20	Insulation Resistance		>1012 Ω Normal
21	Electric strength		>1.3kv/mm
22	S / M abrasion		>6H
23	Thermal stress		288 ℃ 10 Sec.
24	Test Voltage		50-300V