PCB CAPABILITIES

               

Item  Description  Technical capabilities
1  Materials   FR4, H-TG, Teflon, Rogers, Ceramics, Aluminum, FPC
2  Surface Finished   HAL, ENIG, Imsn OSP, Plating AG, Plating gold
3  Layers  1-32 layers
4  Max. Board size  610 × 2000mm
5  Max. Board Thickness  6mm
6  Min. Board Thickness  2-layers 0.15mm
  4-layers 0.4mm
  6-layers 0.6mm
  8-layers 1.5mm
  10-layers 1.6mm
7  Internal layer designed trace width / space (minimum)  Copper Thickness 1/3 OZ.  3mil (0.0762mm)
  Copper Thickness 1/2 OZ.  4mil (0.100mm)
  Copper Thickness 1 OZ.  5mil (0.127mm)
  Copper Thickness 2 OZ.  7mil (0.178mm)
  Copper Thickness 3 OZ.  8mil (0.203mm)
  Copper Thickness 4 OZ. +  10mil (0.254mm)
8  Copper thickness  1/3 OZ. - 10 OZ.
9  Min. S / M Pitch   0.1mm (4mil)
10  Min. hole size   0.15mm (6mil)
11  Min. blind / buried via   0.2mm (8mil)
12  Hole dia. Tolerance (PTH)   ±0.05mm (2mil)
13  Hole dia. Tolerance (NPTH)   ±0.05mm (2mil)
14  Hole position deviation   ±0.05mm (2mil)
15  Outline tolerance   ±0.10mm (4mil)
16  Solder mask Color   Black, Yellow, Blue, Green, Red, White
17  Silkscreen Color   White, Black, Yellow
18  Silkscreen Font Thickness (minimum)  0.15mm (6mil)
19  Twist & Bent   0.75%
20  Insulation Resistance   >1012 Ω Normal
21  Electric strength   >1.3kv/mm
22  S / M abrasion   >6H
23  Thermal stress   288 ℃ 10 Sec.
24  Test Voltage   50-300V

               

               

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